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M6050
1.Scope The specifications should be applied to electret condenser microphone of DGO6050CD(-P) 2.Storage And Judgement Conditions Temperature Range(°C)Rel. Humidity（%）Static Pressure（kPa）Judgement 19～21 60～70 86～106 Storage -30～70 Operating -20～603.Specifications Test Conditions：VS=4.5V，RL=2.2KΩ,Temp=20±2°C, R.H=60±5% ITEMSymbolTest ConditionsMinStandardMaxUnitSensitivity Sf=1KHz,S.P.L=1Pa-54-52-50 dB0dB=1V/PaImpedance Zf=1KHz,S.P.L=1Pa 2.2KΩDirectivity Omni-directionalCurrent Consumption I 50 500μAOperation Voltage Range VS 1.04.510VS/N Ratio S/N(A)f=1KHz,S.P.L=1PaA Curve55 dBDecreacing Voltage Characteristic △Sf=1KHz,S.P.L=1PaVS=4.5-3.0V -3dBMax.Input Sound Level MISPLf=1KHz,Distortion<3% 110dB4.Frequency Response .png "1(17).png")
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6.Test Circuit Measurement CircuitVs:Source Voltage 4.5V RL:Load Resistance 2.2KΩ
7.Test Setup Drawing
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8. Reliability Test
All tests should be done after 2 hours of conditioning at 20℃,R.H65% ,while the sensitivity is to be within ±3dB from the initial sensitivity after the following experiments.
8.1 High Temperature Test High temperature: +80℃ Duration: 72 hours 8.2 Low Temperature Test Low temperature: -40℃ Duration: 72 hours 8.3 Temperature Cycle Test (See in Fig.1) Low temperature: -40℃ High temperature: +80℃ Changeover time: 10min Duration: 30min Cycle: 32
8.4 Statical Humidity Test Temperature: +40℃ Relative humidity: 90～95% Duration: 72hours |
8.5 Vibration Test Amplitude : 1.52mm Duration: 1minutes /plane Freq.range: 10～55 Hz Total time: 2 hours 8.6 Dropping Test Drop a unit unpacked onto a board of 20mm thick.
Height: 1.0 m Cycle: 6
9. Regarding the Soldering operation a. Use 25~ 30W soldering iron and maintain 310℃~330℃ in operation. b. Operators who work in the solder fixture and the soldering iron must be statically grounded under each soldering process. C. Soldering should be accomplished within two seconds at each terminal so as not to be overheated. d . Optimal design for heat sink pad is same as below.
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NO. | Part name | Material Type | Qty | Origin | Manufacture | Remarks |
1 | PCB | FR-4 | 1 | |||
2 | FET | K596 | 1 | |||
3 | Holder | POM | 1 | |||
4 | Back plate | Cu | 1 | |||
5 | Spacer | Mylar | 1 | |||
6 | Film | FEP | 1 | |||
7 | Outer most shell | AL | 1 | |||
8 | Cloth | Fabrics | 1 |
10、Assembly process a)、After connector and holder are once disassembled , they should not be re-used. b)、Do not touch outer springs directly(except for PCB or proper terminal set at nominal height. c)、Do not give any mechanical shocks to the micphone(e.g. dropping to floor)
11、General information 11-1: This microphone shall not be operated or stored in following environment. >where liquid(water,solvent and so on)splashes. >where the air has a high concentration of corrosive gas . >where is too dusty. >where temperature changes rapidly.
11-2: Frequency response especially in high frequency region is dependent on the structure of enclosure.
Please remove additional acoustic mass or cavity in front of the microphone to the utmost.
12-3:do not put mechanical pressure more than 2 kg to the microphone.
13-4: microphone should not be in state of outgoing packing for a long-term storage.
14-5: all the soldering procedures upon microphone must be complete in a metallic device,the temperature of the soldering irons must be limited as 320℃ and less 3 s ,the operators、the solder fixtures and the soldering irons must be statically grounded under each soldering process. |
